High-Temperature Tape for Release Paper

I. Product Overview High-temperature tape for release paper is a heat-resistant adhesive tape used in adhesive with release paper. It features both high-temperature resistance and low peel strength, and is used for temporary fixing and adhesive protection during release paper processing. It is suitable for release paper applications in high-temperature environments such as baking and electronics. II. Key Features · High-temperature resistance: Withstands temperatures from -20℃ to 260℃, leaving no residual adhesive or aging under high temperatures. · Low viscosity and easy peeling: Peel strength with release paper ≤5g/25mm, peeling without residue and without damaging the substrate. · Stable adhesive: Uniform adhesive surface, solvent-resistant, suitable for release paper cutting, laminating and other processes. III. Common Specifications · Width: 10-1000mm, length: 50-1000m (customizable). · Thickness: 0.05-0.2mm, substrate is PET film. · Temperature resistance level: Short-term temperature resistance up to 260℃, long-term temperature resistance up to 180℃. IV. Typical Applications High-temperature die-cutting positioning of release paper, fixing of release paper for baking, adhesive protection of release paper for electronic components.